e900f41ce3
* Heat transfer and thermal stress: thermal materials, temperature BCs, heat loads, heat transfer and coupled temperature–displacement steps, solve.heat
Model: Material.thermal (conductivity, specific heat, expansion, isotropic or
per axis; reference temperature), BoundaryCondition::Temperature (dof 11),
loads SurfaceFlux, Convection, HeatSource and Temperature (a field in static
steps), procedures HeatTransfer { transient (θ-method) } and
CoupledTemperatureDisplacement; checks for missing conductivity/specific
heat/expansion. fem: heat conduction kernels (conductivity, capacity,
source, face flux/film, heat flux) on the DofLayout (one T per node), thermal
strain load and stress D(ε − ε_th) for every solid formulation incl.
incompatible modes. Solver: steady and transient heat transfer, thermal loads
in static steps, coupled steps (exact one-way coupling). Engine: solve.heat,
temperature/heat-flux result fields, probes. Decks refuse heat transfer by
name. Analytic verification: slab, source+convection/flux, thick cylinder,
erfc semi-infinite solid, free/constrained expansion, bimetal strip, coupled
step.
Co-Authored-By: Claude Opus 5.5 <[email protected]>
Claude-Session: https://claude.ai/code/session_01NmAttHhUZTokgPeEJia8sm
* thermal: strains in 2D elements and explicit dynamics
Plane::thermal_load and stresses_with for plane stress (εzz free), plane
strain (σzz = −D₃·ε_th) and axisymmetric elements, incompatible modes
included; the solver's 2D kernels take them. Explicit dynamics turns a
step's temperature loads into a per-element thermal strain rate (reached
linearly over the step) subtracted from each strain increment, so it feeds
J2 and Johnson–Cook updates. Verified: free expansion in every 2D theory
and element, a biaxially held plate, an explicit free bar (ΔL = αΔT L,
stress-free) and a clamped bar at −EαΔT, capped at the yield stress with
perfect plasticity.
Co-Authored-By: Claude Opus 5.5 <[email protected]>
Claude-Session: https://claude.ai/code/session_01NmAttHhUZTokgPeEJia8sm
* clippy
Co-Authored-By: Claude Opus 5.5 <[email protected]>
Claude-Session: https://claude.ai/code/session_01NmAttHhUZTokgPeEJia8sm
* thermal: trusses take the axial thermal strain; keep the roadmap's M7 line
Truss::thermal_load and stresses_with project the thermal strain on the
member's tangent (Σ αₖ tₖ² ΔT); the static solver applies them to rod2/rod3
(#38). Explicit trusses take none yet and a warning says so.
Co-Authored-By: Claude Opus 5.5 <[email protected]>
Claude-Session: https://claude.ai/code/session_01NmAttHhUZTokgPeEJia8sm
---------
Co-authored-by: jyviko <[email protected]>
Co-authored-by: Claude Opus 5.5 <[email protected]>
ModelCraft
An open-source, clean-room CAE modeling application in pure Rust: geometry to analysis-ready finite element models, with robust tetrahedral and hexahedral meshing, solver decks for Abaqus, Nastran and LS-DYNA, and its own linear static and modal solver. Desktop, browser and AI agents drive the same commands.
Status: early. The workspace, quality gates, the FE model, the command engine and the geometry boundary (SolidCraft's kernel and tessellator) are in place; meshing is next. See ROADMAP.md.
Build
cargo xtask ci # fmt, assets, licences, layers, clippy, tests, wasm
cargo xtask test --heavy # the heavy (ignored) tests and the doc tests
cargo run -p modelcraft-cli -- commands # every command and its parameters
cargo run -p modelcraft-cli -- run script.json # run a command script
Rust 1.95 or later, with the wasm32-unknown-unknown target for cargo xtask ci.
Documentation
- Architecture: crates, layers and the meshing pipeline
- Libraries and licences
- Contributing and agent instructions
License
Dual-licensed under MIT or Apache-2.0, at your option. Notices are in NOTICE; third-party licences in THIRD-PARTY-LICENSES.txt.
ModelCraft is an independent project, not affiliated with, sponsored or endorsed by Dassault Systèmes, MSC Software, Siemens or Ansys. Abaqus, Nastran, MSC Nastran, Simcenter Nastran and LS-DYNA are trademarks of their owners and are named only to describe file compatibility.